According to analyst Ming-Chi Kuo, the iPhone 7 will be the thinnest yet at between 6 and 6.5mm thick. That is around the same as the iPad Air 2, and a millimeter thinner than the current generation iPhone. Kuo updated his thoughts on the iPhone 7 with another report, claiming it will run on a new A10 chip built entirely by TSMC, a Taiwanese chip manufacturer that has worked with Apple in the past, and built some of the current A9 processors. He also claims the iPhone 7 Plus will have 3GB of RAM, while the iPhone 7 will only use 2GB. Foxconn will apparently manufacture the iPhone 7 and 7 Plus, and it should launch towards the end of next year, says Kuo.